Bending Systems for In-Situ experiments in SEM, REM, Light Microscopy and Gloveboxes
Bending modules 200N top-/sideview
Deformation device, suitable for work under vacuum in the scanning electron microscope.
Continuously adjustable speed range from 0.2 -20 μm/sec.
It allows 3-point or 4-point bending tests.
Optional expandable to 500N.
Datenblatt Download
Bending modules 5kN sideview
Deformation device,customized for use under the Atomic Force microscope.
Suitable for work under vacuum in the scanning electron microscope.
Display of specimens in sectional view or top view. adjustable speed range from 2 to 150 μm/sec.
It allows 3-point or 4-point bending.
Datenblatt Download
Bending modules 5kN topview
Deformation device,customized for use under the Atomic Force microscope.
Suitable for work under vacuum in the scanning electron microscope and light microscope.
Display of specimens in top view. adjustable speed range from 0,2 to 150 μm/sec.
It allows 3-point or 4-point bending.
Datenblatt Download
Kipp-Biegemodul 200N
For compression experiments
Low and high forces
Holder to be used in the tensile module as an exchangeable compression device. Suitable for X-ray applications
Datenblatt Download
Bending module 200N
Deformation device, suitable for work under vacuum in the scanning electron microscope.
Continuously adjustable speed range from 0.2 -20 μm/sec.
It allows 3-point or 4-point bending tests.
Optional expandable to 500N.
Datenblatt Download
Bending module 5kN sideview
Deformation device,customized for use under the Atomic Force microscope.
Suitable for work under vacuum in the scanning electron microscope.
Display of specimens in sectional view or top view. adjustable speed range from 2 to 150 μm/sec.
It allows 3-point or 4-point bending.
Datenblatt Download
Bending module 5kN topview
Deformation device,customized for use under the Atomic Force microscope.
Suitable for work under vacuum in the scanning electron microscope and light microscope.
Display of specimens in top view. adjustable speed range from 0,2 to 20 μm/sec.
It allows 3-point or 4-point bending.
Datenblatt Download
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